Plasma Treatment Applications

Plasma Activation

通过血浆激活，可以修改非反应性或不可溶质表面以获得更高的表面能，更好的润湿和更好的粘附特性。粘附的这种增加导致产品性能和可靠性的提高。制造过程易于设置，优化和控制。在当今行业中使用的大多数首选材料中，可以实现合理甚至很短的过程。

PDMS键合和微流体学

An important field for low pressure plasma is the activation of polydimethylsiloxane (PDMS) for the design and production of microfluidic systems in medical and industrial applications. These devices are produced from a special class of PDMS bonded to glass, itself or other polymers. A common PDMS is Dow Sylgard 184 which is designed and structured individually for each specific application. Microfluidics manufacturers use plasma treatment to enable bonding PDMS components, polymers or to Si-containing elements like glass or pure silicon.

Plasma Cleaning

Plasma Cleaning is the process of removing unwanted contaminants from a surface by gasification or changing the phase of the foreign material (solid or liquid) to a gas. This gas is then removed from the area of the surface resulting in clean material.

血浆清洁涉及一组广泛的制造运营，包括：血浆清洁（去除有机材料），血浆清洁（去除无机材料），防腐等离子体清洁（去除生物学元素），超细血浆清洁（以改善航空空间和微机械设备）和脱脂。

Plasma cleaning eliminates the need for solvents and other cleaning methods that produce Volatile Organic Compounds (VOC) for a cleaner and safer manufacturing process.

Plasma Coating

等离子体涂料是一种使用添加过程来修改材料表面的性质的应用。借助这种处理方法，可以使表面成为疏水，亲水，刮擦或耐腐蚀，金属化或许多其他化学或分子表面终止。

Low Friction Coating

Low friction coating is the process of applying a plasma deposited layer of material to a high friction surface that would typically be tacky or binding. This is often done on the surface of elastomeric O-rings or seals to ease handling during manufacturing and product assembly. This process also makes the O-rings less tacky so they can be vibatory bowl fed for use with automation systems or equipment for product assembly.

Plasma Etching

Plasma etching is the process of removing material from a surface by gasification or changing the phase of the material to a gas. This gas is then removed from the general area of the surface. Plasma etching describes a broad group of operations to include; Non corrosive etching, corrosive service etching, or physical etching.

Rie- Reactive Ion Etching

尽管术语“ rie”（反应性离子蚀刻）和“等离子体蚀刻”通常是代名词的，但实际上它们并不相同。血浆蚀刻是所有蚀刻程序的伞项，而RIE是一种亚型，可以用血浆执行，它采用了带电离子向零件表面加速的亚型。这种加速度可以方向提高原子的蚀刻速率。意味着垂直于表面的材料的蚀刻速率比平行于表面的材料的蚀刻速率快。

In RIE the process of this differential velocity or differential etching rate means you can have less distance between etched features. This allows the size of the features produced to get smaller and the density of the features to increase. RIE is commonly used in the semiconductor and Micro Electro Mechanical Systems (MEMS).