An important field for low pressure plasma is the activation of polydimethylsiloxane (PDMS) for the design and production of microfluidic systems in medical and industrial applications. These devices are produced from a special class of PDMS bonded to glass, itself or other polymers. A common PDMS is Dow Sylgard 184 which is designed and structured individually for each specific application. Microfluidics manufacturers use plasma treatment to enable bonding PDMS components, polymers or to Si-containing elements like glass or pure silicon.
Plasma Cleaning is the process of removing unwanted contaminants from a surface by gasification or changing the phase of the foreign material (solid or liquid) to a gas. This gas is then removed from the area of the surface resulting in clean material.
Plasma cleaning eliminates the need for solvents and other cleaning methods that produce Volatile Organic Compounds (VOC) for a cleaner and safer manufacturing process.
Low friction coating is the process of applying a plasma deposited layer of material to a high friction surface that would typically be tacky or binding. This is often done on the surface of elastomeric O-rings or seals to ease handling during manufacturing and product assembly. This process also makes the O-rings less tacky so they can be vibatory bowl fed for use with automation systems or equipment for product assembly.
A dielectric barrier discharge is a dry method of plasma treatment which doesn't generate waste water or require drying of the material after treatment.
Plasma is produced by two electrodes with a dielectric between these electrodes to limit the current flow in the plasma. This low density plasma can be described as Dielectric Barrier Discharge or DBD for short.
This method of plasma production is also called silent discharge due the current limiting dielectric controlling the rate of ionization of the gas. This relatively low density plasma produces controlled ionization of the available gas generating little to no detectable sound. This method of low level density plasma production is useful in gas plasma processing like ozone generation, gas reforming, and broad area low level activation processes.
Plasma etching is the process of removing material from a surface by gasification or changing the phase of the material to a gas. This gas is then removed from the general area of the surface. Plasma etching describes a broad group of operations to include; Non corrosive etching, corrosive service etching, or physical etching.
In RIE the process of this differential velocity or differential etching rate means you can have less distance between etched features. This allows the size of the features produced to get smaller and the density of the features to increase. RIE is commonly used in the semiconductor and Micro Electro Mechanical Systems (MEMS).
Polypropylene (PP) is a thermoplastic superhero, ideal for manufacturing tough, robust products ranging from car bumpers and medical devices to high-performance fabrics for harsh environments. In...